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When the squeegee moves forward at a certain speed and angle, a certain pressure is generated on the solder paste, which pushes the solder paste to roll in front of the squeegee, and generates the pressure required to inject the solder paste into the mesh (ie, the opening of the template). The friction force causes the solder paste to shear at the junction of the squeegee and the stencil (template opening), and the shear force reduces the viscosity of the solder paste, thereby smoothly injecting into the mesh; when the squeegee leaves the template opening, the solder paste The viscosity quickly returns to its original state.
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